Reliability tests of ultrasonic and thermosonic wire bonds
Fragment książki (Materiały konferencyjne)
MNiSW
15
WOS
| Status: | |
| Autorzy: | Lizak Tomasz, Kociubiński Andrzej |
| Wersja dokumentu: | Drukowana | Elektroniczna |
| Arkusze wydawnicze: | 0,5 |
| Język: | angielski |
| Strony: | 1214 - 1222 |
| Web of Science® Times Cited: | 0 |
| Scopus® Cytowania: | 1 |
| Bazy: | Web of Science | Scopus | Web of Science Core Collection | Google Scholar |
| Efekt badań statutowych | NIE |
| Materiał konferencyjny: | TAK |
| Nazwa konferencji: | 36th IEEE-SPIE Joint Symposium on Photonics, Web Engineering, Electronics for Astronomy and High Energy Physics Experiments |
| Termin konferencji: | 26 maja 2015 do 1 czerwca 2015 |
| Miasto konferencji: | Wilga |
| Państwo konferencji: | POLSKA |
| Publikacja OA: | NIE |
| Abstrakty: | angielski |
| This paper presents analysis of mechanical strength and reliability of wire bonds in context of the applied bonding technique, wire material and substrate type used as well as bonding parameters. The investigation conducted includes a selection of parameters affecting process of effective wire bonds forming by 53XX F&K Delvotec Bonder and implementation of wire bonds with ultrasonic and thermosonic techniques, using various substrates combined with gold and aluminum 25 μm diameter wires. Furthermore, reliability and quality test made by bond pull technique have been presented and discussed. © (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only. |
