Stress modification in gold metal thin films during thermal annealing
Artykuł w czasopiśmie
| Status: | |
| Autorzy: | Prószyński Adam, Chocyk Dariusz, Gładyszewski Grzegorz |
| Rok wydania: | 2009 |
| Wersja dokumentu: | Drukowana | Elektroniczna |
| Język: | angielski |
| Numer czasopisma: | 4 |
| Wolumen/Tom: | 39 |
| Strony: | 705 - 710 |
| Impact Factor: | 0,358 |
| Web of Science® Times Cited: | 12 |
| Bazy: | Web of Science |
| Efekt badań statutowych | NIE |
| Materiał konferencyjny: | NIE |
| Publikacja OA: | NIE |
| Abstrakty: | angielski |
| Stress evolution during deposition of 50 nm Au thin films by thermal evaporation in a UHV system and then stress modification during thermal vacuum annealing have been performed. For stress measurement a substrate curvature approach has been applied. The changes in stress versus temperature linked to a modification of microstructure has been interpreted. To obtain any information about structural changes in the film X-ray diffraction measurements has been performed. We can conclude from the measurements that during the first cycle some irreversible structural modifications occur in a metal film. |
