Baza Publikacji Pracowników Politechniki Lubelskiej

Status:
Autorzy:	Chocyk Dariusz, Prószyński Adam, Gładyszewski Grzegorz, Pieńkos Tomasz, Gładyszewski Longin
Rok wydania:	2005
Wersja dokumentu:	Drukowana \| Elektroniczna
Język:	angielski
Numer czasopisma:	3
Wolumen/Tom:	35
Strony:	419 - 424
Impact Factor:	0,459
Web of Science® Times Cited:	4
Scopus® Cytowania:	4
Bazy:	Web of Science \| Scopus
Efekt badań statutowych	NIE
Materiał konferencyjny:	NIE
Publikacja OA:	NIE
Abstrakty:	angielski
	Evolution of stresses in thin Cu and Ag films after deposition by thermal evaporation in UHV system is studied. Thin films were deposited on 100 mm thick Si substrate at room temperature. Deposition rates for the Cu and Ag films were 0.5 A/s and 0.9 A/s, respectively. The total thickness ranged from 7.7 up to 109 nm. The average stress in the films was determined by measuring the radius of samples curvature. The behavior of stress evolution curves is explained by two mechanisms of stress generation: filling grain boundaries and islands coalescence.

Post-deposition stress evolution in Cu and Ag thin films