Evolution of stress and structure in Cu thin films
Artykuł w czasopiśmie
| Status: | |
| Autorzy: | Chocyk Dariusz, Zientarski Tomasz, Prószyński Adam, Pieńkos Tomasz, Gładyszewski Longin, Gładyszewski Grzegorz |
| Rok wydania: | 2005 |
| Wersja dokumentu: | Drukowana | Elektroniczna |
| Język: | angielski |
| Numer czasopisma: | 4-5 |
| Wolumen/Tom: | 40 |
| Strony: | 509 - 516 |
| Impact Factor: | 0,833 |
| Web of Science® Times Cited: | 22 |
| Scopus® Cytowania: | 21 |
| Bazy: | Web of Science | Scopus |
| Efekt badań statutowych | NIE |
| Materiał konferencyjny: | NIE |
| Publikacja OA: | TAK |
| Licencja: | |
| Sposób udostępnienia: | Witryna wydawcy |
| Wersja tekstu: | Ostateczna wersja opublikowana |
| Czas opublikowania: | W momencie opublikowania |
| Abstrakty: | angielski |
| Evolution of stresses developing in Cu thin films during and after deposition by thermal evaporation in UHV system is studied. Thin films were deposited on 100 µm thick Si substrate at room temperature. Deposition rates for the films were changed between 0.2 Å/s and 2.0 Å/s, while the total thickness was changed from 7.7 nm to 155 nm. Deformation analysis of crystalline lattice and microstructure was performed by x‐ray diffraction measurements (θ‐2θ scans, “sin2ψ” method). The surface morphology of film was studied by atomic force microscopy. The average stress in the films was determined by measuring the radius of curvature of samples. For thin films three stages of stress evolution (compressive, tensile and compressive) were we distinguished. This behavior is characteristic for materials with a Volmer‐Weber mode. A three‐dimensional molecular dynamics technique was applied for simulating the stress calculation during thin film growth. The results obtained from the simulation are consistent with the experimental results. (© 2005 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim) |
