Technology and measurements of three-layer NiFeCuMo/Ti/NiFeCuMo structures exhibiting the giant magnetoresistance phenomenon
Artykuł w czasopiśmie
MNiSW
70
Lista 2021
Status: | |
Autorzy: | Czarnacka Karolina, Kisała Jakub, Kociubiński Andrzej, Gęca Mateusz |
Dyscypliny: | |
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Rok wydania: | 2022 |
Wersja dokumentu: | Drukowana | Elektroniczna |
Język: | angielski |
Numer czasopisma: | 1 |
Wolumen/Tom: | 40 |
Numer artykułu: | 012806 |
Strony: | 1 - 8 |
Impact Factor: | 1,4 |
Web of Science® Times Cited: | 0 |
Scopus® Cytowania: | 1 |
Bazy: | Web of Science | Scopus |
Efekt badań statutowych | NIE |
Materiał konferencyjny: | NIE |
Publikacja OA: | TAK |
Licencja: | |
Sposób udostępnienia: | Witryna wydawcy |
Wersja tekstu: | Ostateczna wersja opublikowana |
Czas opublikowania: | W momencie opublikowania |
Data opublikowania w OA: | 4 stycznia 2022 |
Abstrakty: | angielski |
Magnetoresistive phenomena are widely used in the construction of magnetic field sensors for biological, space, automotive, etc., applications. For this purpose, a number of methods of obtaining and testing this type of sensor are used. Therefore, the motivation to take up this topic is to obtain a structure showing magnetoresistance and carry out electrical measurements in a magnetic field to confirm the assumptions about the presence of magnetoresistance. This paper focuses on the technology and measurements of thin-film three-layer resistors. Structures NiFeCuMo/Ti/NiFeCuMo with 100/10/100 nm thicknesses were developed in situ using a DC magnetron sputtering method. A scanning electron microscopy or energy dispersive spectroscopy analysis was conducted on a sample structure and the target alloy to establish their chemical composition. The occurrence of the giant magnetoresistance exhibited by the developed three-layers was successfully confirmed in the presence of an applied magnetic field and the maximum value of resistance changes ΔR was approximately 2.75 Ω. Additionally, the thickness of the resistors was determined with a confocal microscope to verify the accuracy of the applied deposition method. |