Strength of Solder and Adhesive Joints of Copper Sheets
Fragment książki (Rozdział monografii pokonferencyjnej)
MNiSW
20
Poziom I
| Status: | |
| Autorzy: | Rudawska Anna, Szabelski Jakub, Miturska-Barańska Izabela, Doluk Elżbieta |
| Dyscypliny: | |
| Aby zobaczyć szczegóły należy się zalogować. | |
| Wersja dokumentu: | Drukowana | Elektroniczna |
| Język: | angielski |
| Strony: | 85 - 95 |
| Web of Science® Times Cited: | 1 |
| Scopus® Cytowania: | 1 |
| Bazy: | Web of Science | Scopus |
| Efekt badań statutowych | NIE |
| Finansowanie: | Projekt „Politechnika Lubelska – Regionalna Inicjatywa Doskonałości”, finansowany ze środków Ministerstwa Nauki i Szkolnictwa Wyższego. |
| Materiał konferencyjny: | TAK |
| Nazwa konferencji: | 9th International Conference on Fracture, Fatigue and Wear |
| Skrócona nazwa konferencji: | FFW 2021 |
| URL serii konferencji: | LINK |
| Termin konferencji: | 2 sierpnia 2021 do 3 sierpnia 2021 |
| Miasto konferencji: | Ghent University |
| Państwo konferencji: | BELGIA |
| Publikacja OA: | NIE |
| Abstrakty: | angielski |
| In order to compare selected strength aspects of solder and adhesive joints made of M1E z4 copper sheet, destructive tests of load capacity were performed. In the case of solder butt joints, three different fluxes were analysed, while four different adhesive compositions were tested for adhesive lap joints. Different types of joints were also used in both groups. The results of the strength tests of joints’ load capacity were subjected to statistical analysis, homogeneous groups and the importance of differences between the various methods of assembly joints made using the same technology were specified, and then adhesive and solder joints with insignificant differences in terms of strength were determined. It was found that in the case of solder joints, the highest and lowest values of load capacity were obtained for joints made with Unifix paste and Fosol as flux, respectively. The highest load capacity value was obtained for the adhesive joints made with the E53/PAC/100:80 composition, while the lowest was obtained for the adhesive joints made with the E5/Z1/100:12 adhesive composition. It was demonstrated that the analysed solder joints are between the strongest and the weakest adhesive joints. |
