Apparent Young's Modulus of Epoxy Adhesives
Artykuł w czasopiśmie
MNiSW
140
Lista 2021
Status: | |
Autorzy: | Anasiewicz Kamil, Kuczmaszewski Józef |
Dyscypliny: | |
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Rok wydania: | 2022 |
Wersja dokumentu: | Drukowana | Elektroniczna |
Język: | angielski |
Numer czasopisma: | 22 |
Wolumen/Tom: | 15 |
Numer artykułu: | 8060 |
Strony: | 1 - 14 |
Impact Factor: | 3,4 |
Web of Science® Times Cited: | 3 |
Scopus® Cytowania: | 3 |
Bazy: | Web of Science | Scopus |
Efekt badań statutowych | NIE |
Finansowanie: | The research was financed in the framework of the project Lublin University of Technology— Regional Excellence Initiative, funded by the Polish Ministry of Science and Higher Education (contract no. 030/RID/2018/19). |
Materiał konferencyjny: | NIE |
Publikacja OA: | TAK |
Licencja: | |
Sposób udostępnienia: | Witryna wydawcy |
Wersja tekstu: | Ostateczna wersja opublikowana |
Czas opublikowania: | W momencie opublikowania |
Data opublikowania w OA: | 15 listopada 2022 |
Abstrakty: | angielski |
This article presents the results of a study of the properties of epoxy adhesives in an adhesive joint. The study analysed changes in Young’s modulus values as a function of the rigidity of the adhesive and the type of joined material. The values of Young’s modulus values were determined on the thickness of the adhesive joint using the nanoindentation method and in a tensile test of dumbbell shape sample for the adhesive material. The obtained results were analysed in terms of changes to the values of Young’s modulus of the adhesive as a function of the distance from the joined material–adhesive phase boundary and compared to the adhesive material. Zones were distinguished in the layer of the adhesive joint—adjacent to the wall and the core, with different values of Young’s modulus. Conclusions were drawn, indicating the relationship between the adhesive joint thickness and the increase in the value of Young’s modulus. Significant differences were found in the values of Young’s modulus of the adhesive joint compared to Young’s modulus of the adhesive in the form of plastic. |